Download PDF by Hao Yu,Chuan-Seng Tan,Chuan Seng Tan: Advances in 3D Integrated Circuits and Systems (Series on

By Hao Yu,Chuan-Seng Tan,Chuan Seng Tan

ISBN-10: 9814699004

ISBN-13: 9789814699006

ISBN-10: 9814699012

ISBN-13: 9789814699013

3D integration is an rising know-how for the layout of many-core microprocessors and reminiscence integration. This booklet, Advances in 3D built-in Circuits and Systems, is written to aid readers comprehend 3D built-in circuits in 3 phases: equipment fundamentals, process point administration, and actual designs.

Contents awarded during this ebook contain fabrication strategies for 3D TSV and 2.5D TSI; equipment modeling; actual designs; thermal, strength and I/O administration; and 3D designs of sensors, I/Os, multi-core processors, and memory.

Advanced undergraduates, graduate scholars, researchers and engineers may perhaps locate this article worthwhile for realizing the various demanding situations confronted within the improvement and construction of 3D built-in circuits and systems.

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Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems) by Hao Yu,Chuan-Seng Tan,Chuan Seng Tan

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